Advanced Technology Japan Engineer, WoW Bonding

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 ATE（Advanced Technology Engineering）部門におけるWafer Bondingプロセスエンジニアとして、次世代技術の導入・立ち上げ・最適化を担当します。最新鋭装置評価、プロセス開発及び改善、歩留まり向上、コスト削減、生産性改善に関する活動を推進し、RnD、他サイト、各種Supplierなどのグローバルチームと連携して技術課題を解決します。 本ポジションでは、DOE/SPC/FMEAなどの手法を用いてプロセスの信頼性を確保し、品質・コスト・リスク管理の目標達成に貢献します。 As a Wafer Bonding Process Engineer in ATE (Advanced Technology Engineering) department, you will be responsible for introducing, ramping up, and optimizing next-generation technologies. Your role includes evaluating state-of-the-art equipment, developing and improving processes, driving yield enhancement, cost reduction, and productivity improvement initiatives. You will collaborate with global teams such as R&D, other sites, and various suppliers to resolve technical challenges. In this position, you will utilize methodologies such as DOE, SPC and FMEA to ensure process reliability and contribute to achieving goals in quality, cost, and risk management. 職務内容 Wafer Bondingプロセスの開発・最適化 Wafer Bonding、Si Grinding、Bevel Trimmingの統合最適化 装置評価・導入・アップグレード 新規装置のセットアップ、性能評価、プロセス安定化 装置メーカーとの技術協議、仕様改善提案 品質・歩留まり改善活動 SPCメトリクス導入、異常解析、再発防止策策定 FMEA、8D問題解決手法によるリスク低減 技術開発プロジェクトの推進 次世代技術の量産移行に向けたプロセス開発 グローバルチームとの共同研究、標準化活動 材料サプライヤーとの連携による品質・コスト・リスク管理 Job Responsibilities Development and Optimization of Wafer Bonding Processes Integrated Optimization of Wafer Bonding, Si Grinding, and Bevel Trimming Equipment Evaluation, Installation, and Upgrades Set up new equipment, perform performance evaluations, and stabilize processes Conduct technical discussions with equipment vendors and propose specification improvements Quality and Yield Improvement Activities Implement SPC metrics, perform abnormality analysis, and establish preventive measures Reduce risks using FMEA and 8D problem-solving methodologies Driving Technology Development Projects Develop processes for transitioning next-generation technologies to mass production Collaborate with global teams on joint research and standardization activities Coordinate with Material Suppliers for Quality, Cost, and Risk Management 応募要件 必須スキル・経験 Wafer Bonding、Si Grinding、Bevel Trimmingの実務経験 半導体パッケージ技術に関する深い知識 DOE、SPC、FMEAなどの品質改善手法の実務経験 英語での技術コミュニケーション能力（グローバルチーム対応） Microsoft Office（Excel、Word、PowerPoint） 歓迎スキル CMPや3D集積技術の経験 LabVIEW、FPGA制御、Python/Matlabによるデータ解析・自動化スキル プロジェクトリード経験、標準化活動への参画経験 日本語でのコミュニケーション能力 Required Skills and Experience Practical experience in Wafer Bonding, Si Grinding, and Bevel Trimming In-depth knowledge of semiconductor packaging technologies Hands-on experience with quality improvement methodologies such as DOE, SPC, and FMEA Ability to communicate technical information effectively in English (for collaboration with global teams) Proficiency in Microsoft Office (Excel, Word, PowerPoint) Preferred Skills Experience with CMP and 3D integration technologies Skills in data analysis and automation using LabVIEW, FPGA control, Python, or MATLAB Experience in project leadership and participation in standardization activities Japanese language proficiency at a conversational level. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. 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