Assembly Die Bond Process Engineer

Job description

Job Summary The Assembly Die Bond Engineer is responsible for developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing. The role focuses on achieving high product quality, yield improvement, process stability, cycle time reduction, and cost efficiency while supporting new product introductions (NPI) and continuous improvement initiatives. Key Responsibilities Process Development & Optimization Develop, qualify, and optimize die bonding processes for semiconductor packages. Establish process parameters and operating specifications. Perform process characterization and verification activities. Support new package development and technology transfers. Production Support Provide daily engineering support to manufacturing operations. Troubleshoot die bondprocess-related issues. Analyze yield losses and process excursions. Implement corrective and preventive actions (CAPA). Quality & Reliability Monitor process capability (Cp/Cpk) and manufacturing yields. Conduct root cause analysis using tools such as 8D, Fishbone, 5 Why, and FMEA. Ensure compliance with quality standards and customer requirements. Support reliability testing and qualification activities. Continuous Improvement Drive cost reduction, productivity enhancement, and waste elimination projects. Utilize Lean Manufacturing and Six Sigma methodologies. Lead or participate in continuous improvement initiatives. Documentation & Compliance Create and maintain process documentation, work instructions, and specifications. Prepare engineering reports, qualification reports, and technical presentations. Ensure compliance with safety, environmental, and company standards. Qualification: Bachelor/Master in related engineering major with semiconductor experience in Die bond. More information about NXP in Malaysia... #LI-633a