Automotive High-Speed Hardware Design Engineer

Job description

Key Responsibilities: • Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production • Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes. • Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency. • Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails. • Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions. • Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews. • Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization. • Collaborate with PCB layout engineers for constraint-driven designs (impedance, stackup, crosstalk, EMI/EMC). • Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis. • Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages. • Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability. • Create design documentation, validation reports, and participate in technical reviews and customer discussions. • Required Skills and Experience: • Bachelor’s or Master’s Degree in Electronics, Electrical, or related engineering field. • 5–9 years of hands-on experience in automotive hardware design. • Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX). • Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains. • Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes). • Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence). • Knowledge of Automotive Safety (ISO 26262 – ASIL B to D compliance). • Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing. • Understanding of thermal design, power sequencing, and power distribution. • Experience in camera/radar interface and sensor fusion hardware design. • Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR8000). • Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.). • Excellent analytical, communication, and documentation skills. • Preferred Qualifications: • Experience with ASIL-D compliant ECU development. • Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks. • Knowledge of thermal simulation and mechanical integration. • Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs. • Experience working with global OEMs and Tier-1s on production projects. • Key Tools & Technologies: • Schematic/PCB: Zuken , Altium Designer, Cadence Allegro, Mentor Graphics • Simulation: HyperLynx, Ansys SIwave, Sigrity, SPICE, ADS • Compliance & Debug: Oscilloscope (≥20GHz), Vector CANoe, Power Analyzer, JTAG • Documentation: PDM/PLM systems, Jira, Confluenc B.E, Electronics Engineering 5 to 10 years Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 27,000+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is the Technology Powerhouse of Bosch in India with a global footprint and presence in the US, Europe and the Asia Pacific region.