Design Engineer, Microelectronics Packaging

Job description

At IQM, we build world-leading quantum computers for the well-being of humankind. We design systems to tackle computational challenges beyond the practical limits of classical machines. Our work sits at the edge of science and engineering. It's complex, demanding, and deeply collaborative. We turn deep research into reliable, full-stack systems that drive discoveries in fields like medicine, energy, and technology, reshaping how the world computes. Join the team that gives quantum a heartbeat. The work In this role, you will develop the 3D integrated stack that gives our QPUs clean, high-quality microwave and DC connectivity, built to survive and perform at cryogenic temperatures. You will work as part of our Emerging Technologies team, based at our Japan site. Your work sits right at the intersection of IQM's own development teams in Europe and our Japanese partners, helping define the packaging solutions that will let future generations of QPUs scale. What you’ll actually do Develop functionalities and features of the 3D integrated stack for high-quality microwave and DC connectivity under cryogenic operation Define stack and process requirements together with internal teams and external fabrication partners, covering PCB, ceramic, glass, or silicon-based processes Develop, optimize, and characterize die packaging processes for chips built to operate in cryogenic environments Plan and implement testing and validation procedures, both at IQM and together with our Japanese partners Act as the technical link between IQM and our partners, balancing QPU package requirements with what is realistically achievable on their end Contribute to planning test strategies, mapping out what capabilities are available at IQM and at partner sites Get hands on with testing: electrical and thermal characterization of stack features Document your work clearly, so findings are easy to pick up by teammates and partners across time zones Work independently day to day, while staying closely connected to IQM's development teams in Europe What we’re looking for Master's or PhD in experimental physics, electrical engineering, or a related technical field Experience with heterogeneous 3D integration technologies, such as bump bonding or RDL fan-out Working knowledge of standard CAD tools used in package design Understanding of DC, thermal, and/or microwave characterization techniques Familiarity with cryogenic measurement techniques Comfortable working independently, and just as comfortable coordinating across IQM's European teams and external partners Strong documentation skills, and fluent spoken and written English and Japanese Willingness to travel Seen as an advantage Experience with superconducting quantum computing hardware, chips, or system integration Understanding of superconducting materials properties Prior experience collaborating with external fabrication or foundry partners Why IQM? Full-stack quantum computing: From quantum hardware to software layers and beyond, we build across the full-stack. High-performance playground: We aim high, and we know sustainable performance only works when life outside work does too—hybrid setups, flexible hours. Never the smartest: You won’t always be the smartest person in the room. Neither will we. Expect to learn constantly - from each other and beyond with IQM’s Learning Hub, LinkedIn Learning, and a team-based L&D budget. Approachable leadership: Flat hierarchy, direct access. Feel free to approach any leaders. They're friendlier than they look! The sweet spot: Big enough to matter. Small enough to move fast. Growing between a startup and a corporation. We’re in the phase where top performers get noticed. Bigger than IQM: Our people build know-how for the entire quantum ecosystem. We publish papers, run hackathons, and help shape a market that's still being defined. The future of computing won’t build itself. You might be one of the few who do. Meet our people and learn more about IQM on our stories page. Explore our scientific publications. We'll start interviews and move forward with hiring as soon as we meet strong candidates. Please submit your application soon. 600M€+ Total Funding | 400+ Team Members | 30+ Quantum Computers Built | 300+ Patents Filed | 10 Location Globally