Head of Product Development Engineering

**About Ethernovia, Inc.** Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications. Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured **$154M** ($90+M Series-B and $64M Series-A) in **total funding** to date: - [Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips](https://www.businesswire.com/news/home/20260120549197/en/Ethernovia-Raises-Over-%2490-Million-Series-B-to-Scale-Leading-Edge-Autonomy-and-Physical-AI-Networking-Chips) - [Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire](https://www.businesswire.com/news/home/20230515005222/en/Ethernovia-Raises-64-Million-to-Accelerate-the-Revolution-of-Vehicle-Networks/) - (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital) Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025. - March 2026: [Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms](https://www.businesswire.com/news/home/20260316729719/en/Ethernovia-Announces-HSB-Enabled-Networking-Board-for-NVIDIA-Holoscan-Platforms) - January 2024: Our [CEO Ramin Shirani Named MotorTrend Software-Defined Vehicle Innovator Awards Winner ()](https://www.ethernovia.com/blog/ramin-named-motortrend-awards-winner/) - September 2023: [Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
 - Ethernovia](https://www.ethernovia.com/blog/continental-and-ethernovia-announce-partnership/) - **[Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news](https://www.autoconnectedcar.com/2023/09/connected-car-news-helios-continental-ethernovia-avanci-bmw-mapbox-porsche-sema-honda-ultrasense-flex-logix-diodes-inc-garmin-toyota-caruso/#Continental_Ethernovia_for_SDVs)** With talented employees on 4 continents, we have filed 50+ patents to date. Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility. **Head of Product Development Engineering** **Summary:** The Head of Product Development Engineering will be responsible for taking Ethernovia’s products from NPI to HVM. This position requires a leader who is **hands-on with semiconductor product development**. You will bridge the gap between world-class networking chip designs and high-volume, automotive-grade silicon manufacturing. The position is based in San Jose, CA. **Key Responsibilities:** - **End-to-end product test and hardware ownership** from pre-silicon to post-silicon, working with Arch, Design, SW/FW, DFT, System, Test (ATE/BI/SLT) and Q&R. - **Execute NPI bring-up** for **high-speed Ethernet switch and PHY products** ensuring signal integrity and power/performance standards are maintained at scale. - Drive the execution of the **manufacturing flow from wafer starts to sample delivery.** **Own test strategy** across wafer test, final test and system level test. - **Own characterization, ATE to system correlation, productization and manufacturing specs and margins** (transistor to pmic, part to part, aging and grr) - **Own yield improvement across process/package/test, drive test time and test cost reduction**, while maintaining and meeting automotive quality requirements. **Required Experience & Skills: Professional Background** - Bachelor's or Master's degree in Electrical Engineering or a related technical field - **12+ years of experience in fabless semiconductor operations**, specifically for complex, high-performance SOCs or networking ICs. - **Must have direct experience with ATE and SLT testing, characterization**, ATE to system correlation, productization and silicon/package qualification. - **Must have direct experience working with foundries, assembly houses, test houses, and OSATs** in the development of high-volume products from NPI through HVM. - **Expertise with iJTAG, Scan, MBIST, Sensor, SerDes, LSIO/HSIO testing on ATE, bare-metal, functional DVFS** and benchmark testing at SLT and security fusing. - Experience productizing **high-speed communications chips** using ATE and System characterization and correlation data, balancing PPY (power/perf/yield) - Experience navigating the Automotive electronics ecosystem, including IATF 16949, ISO 26262, Safe launch and PPAP (Production Part Approval Process). - Experience working in fast paced start-up environment building cutting edge products. **Technical Leadership & Skills:** - Understanding of high-bandwidth data-path products (**Ethernet, Switching, or high-speed SerDes**). - Expert level experience with yield management systems, data analysis, scripting tools, and statistical data analysis using JMP. - Understanding of product life cycle from concept to end of life and leading pre-silicon review and readiness to enable seamless post-silicon bring-up **Nice to Have (The "Competitive Advantage"):** - Familiarity with their latest FinFET process node, and QFN, LGA/BGA assembly process for automotive products. - Experience delivering high speed SerDes products to Tier-1 automotive OEMs. - Experience managing contractors and leadership experience. **What You Can Expect From Ethernovia:** - Technology depth and breadth expansion that can’t be found in a large company - Opportunity to grow your career as the company grows - Pre IPO stock options - Cutting edge technology - World class team - Competitive base salary - Flexible hours - Medical, dental and vision insurance for employees **Salary Range:** - The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $220,000 - $280,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits. \* Principals Only (No Agencies) #LI-Hybrid