III-V Wafer Fab Process Engineer (Lithography)

Job description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Position Summary The III-V Wafer Fab Process Engineer is responsible for developing, qualifying, and sustaining photolithography and etch processes used in the manufacture of III-V compound semiconductor devices, including InP and GaAs based technologies. The engineer will establish robust manufacturing processes for R&D, new product, optimize yield and process capability, support high-volume manufacturing, and collaborate with cross-functional teams to deliver reliable and cost-effective manufacturing solutions. Key Responsibilities Develop and optimize photolithography processes for III-V wafer fabrication. Establish process windows for critical lithography parameters, including: Photoresist coating, bake and develop Exposure dose and focus Overlay accuracy Critical dimension (CD) control Pattern fidelity and defectivity Qualify new photoresists, developers, bottom anti-reflective coatings (BARC), and lithography materials. Develop processes for broadband, i-line, DUV (193 nm), aligner/stepper/scanner platforms. Optimize lift-off lithography processes for metal patterning. Minimize defects such as particles, bridging, resist lifting, and pattern collapse. Mask Layout and reticle design / tape out Process Qualification Develop qualification plans for new lithography and etch equipment. Define process acceptance criteria and process capability targets. Conduct Design of Experiments (DOE) to optimize process windows. Perform process characterization and statistical analysis. Manufacturing Support Monitor process health using SPC. Investigate process excursions and implement corrective and preventive actions. Troubleshoot lithography and etch-related issues affecting yield or productivity. Support engineering lots, pilot production, and high-volume manufacturing. Yield Improvement Analyze yield loss associated with lithography and etch processes. Perform root cause analysis using 8D, 5 Why, Fishbone, and FMEA methodologies. Drive continuous improvement projects to reduce defects and improve process capability. Process Control & Documentation Develop and maintain: WI, Control Plans, PFMEA, OCAP, Process Recipes, ECO Qualifications Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics. 10+ years of semiconductor wafer fabrication experience. Minimum 10 years of direct experience in lithography and/or plasma etch processes. Experience with III-V semiconductor manufacturing is highly preferred. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.