Lead Engineer, Package Development

Job description

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve. Job Summary: The Senior Development Engineer is an experienced professional who takes a leading role in bringing new products from design to production. This role is responsible for defining test strategies, leading validation efforts, and driving yield improvement for complex products. Operating with a high degree of autonomy, the Senior Development Engineer is a key contributor to on-time product release and profitability. What You Will Do: Collaboration with cross functional teams including Business Units, Device Design, Manufacturing (internal and sub-contract), Quality and Reliability. Creating, maintaining, and updating documentations including standard operation procedures, process flows, workflows, bonding diagrams / drawings, package outline drawings etc. Support the release and adoption of the above documentation. Documentation / reporting on internal procedures and regulatory body requirements. What You Will Need: BS or MS in Electrical or Mechanical Engineering or Materials Science with 5+ years of experience in semiconductor product design, development, and operations / manufacturing environment. Strong expertise in use of AutoCAD, familiar with GD&T standards. Strong expertise in the use of 3D design software such as Autodesk Inventor, SolidWorks, Pro/Engineer (PTC Creo), etc. or equivalent. Strong expertise in the use of software such as Microsoft Word, Excel, Power Point, Project, Visio etc. or equivalent. Strong oral and written communication skills, self-driven and result oriented. Familiarity with project management and APQP processes. Familiarity with industry Qualification standards including JEDEC, AEC-Q100, ASME, IPC, IEC, etc. Familiarity with package design rules is a plus. Familiar with packaging materials including epoxies, molding compounds, wires, solders, leadframe alloys etc. is a plus. Knowledge of packaging assembly processes including wafer back-grinding, dicing, wafer bumping, die attach, flip chip, gold and copper wire bonding, transfer, and injection molding, MCM, surface mount, plating, singulation, etc. is a plus. Why Allegro? Join Allegro and become part of a team where your contributions truly matter. We foster a culture of Real Innovation , empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement. Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology. You’ll experience Real Connection , collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose. Join us—and help build what’s next.