Master's Thesis: Modeling and Simulation of Wafer Bonding Process

Job description

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes. Wafer bonding is a critical process in semiconductor manufacturing, enabling the integration of diverse materials and the creation of complex microsystems. A key phenomenon in this process is the bond wave – the progression of the bonding front across the interface. We are looking for a motivated Master’s student to develop a comprehensive numerical framework to predict bond wave propagation to start as soon as possible. This thesis aims to bridge the gap between traditional analytical models and advanced computational methods, specifically focusing on Finite Element Method (FEM). Be part of change FEM Development: Develop and refine a Finite Element model to simulate the dynamics of the wafer bonding process. Validation: Compare simulation results with existing experimental data to ensure model accuracy and reliability. Interdisciplinary Collaboration: Work closely with the System Packaging and Simulation of Semiconductor Technologies departments to align simulation parameters with physical process constraints. What you contribute Core Requirements: Possible fields of study: Microsystems Engineering, Electrical Engineering, Physics, Materials Science, Nanotechnology, Semiconductor Technology, or related disciplines. Enrolled student in Chemnitz, Mittweida or the surrounding area. Analytical Skills: Solid understanding of mechanics and wave propagation. Programming: Proficiency in Python for analytical modeling and data processing. Strong English and German reading and comprehension skills. An average grade of For data protection reasons, we can only consider applications via our career portal - thank you. Fraunhofer Institute for Electronic Nano Systems ENAS Requisition Number: 84402 Application Deadline: