PCB Design (India)

Job description

Division R&D Department EV Electronics Level Ex Functional Area EV Electronics Design 1 Job Title PCB Design Engineer 2 Reporting Functional reporting to Leadership, R&D – Electronics 3 Background i) Educational Qualification Essential: B.E/ B Tech in Electrical/Electronics, M Tech in Electrical/Electronics is preferred; Min. 70% score required at all levels of education ii) Experience Minimum: 5 Maximum: 12 iii) Age Limit Minimum: 24 Maximum: 35 4 Job Role & Responsibilities Role: EV PCB Design Engineer Technical/ Functional: PCB Layout Design for Power Electronics: Design multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, and battery management systems (BMS). Optimize power planes, creepage & clearance distances, and thermal dissipation for high-voltage (>96V) and high-current applications. Ensure low-inductance routing, controlled impedance, and effective grounding strategies for high-power circuits. Select appropriate PCB materials (FR4, Rogers, Polyimide, etc.) for highreliability applications. Implement EMI/EMC best practices, including shielding, filtering, and differential pair routing. PCB Layout for High-Speed Digital and Communication: Design PCBs for RF modules, antennas, and high-speed signal transmission (GHz range). Implement microstrip, stripline, coplanar waveguides, and controlled impedance routing. Optimize layouts for minimum crosstalk, reflection, and insertion loss. Work closely with RF engineers for layout optimization, grounding, and signal integrity enhancements. Conduct EMI simulations and compliance testing to meet RF regulatory standards. PCB Layout for Analog & Mixed-Signal Circuits: Design low-noise, precision analog circuit layouts, including op-amps, ADCs, DACs, and sensor interfaces. Implement star-grounding, guard rings, and Kelvin sensing techniques for ultra-low- noise performance. Optimize high-precision data acquisition and mixed-signal PCB layouts. Ensure minimized parasitic capacitance and inductance in sensitive analog circuits. Thermal & Mechanical Considerations: Design thermal vias, heat sinks, copper pours, and metal core PCBs (MCPCB) for high-power applications. Work closely with mechanical engineers to optimize PCB integration within enclosures and cooling solutions. Work closely with CFTs to perform thermal simulations and power dissipation analysis for PCB heat management. 5. Design Validation & Compliance: Perform DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Testability) analysis. Conduct PCB design reviews and ensure adherence to design guidelines, EMI/EMC requirements, manufacturability, and reliability standards. Collaborate with fabrication and assembly vendors to ensure high-yield production. Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and automotive/industrial safety norms. 5 Competency Requirements Behavioural: Strong ownership mindset with the ability to independently drive PCB development activities. Hands-on problem-solving approach with high attention to detail. Excellent communication and stakeholder management skills. Strong collaboration skills across cross-functional teams. Ability to anticipate challenges and proactively drive solutions. Quality-first mindset focused on robust and reliable designs. Innovative and continuous improvement mindset with the ability to translate concepts into practical solutions. Specific expertise required for functional area: Proficiency in PCB design tools such as Altium Designer, Cadence and Allegro/OrCAD. Hands-on expertise in Altium Designer preferred. Expertise in multilayer PCB design, stack-up definition, routing optimization, design rule management, and PCB release processes. Experience in power electronics PCB design, including high-voltage and high-current layouts, creepage and clearance requirements, thermal management, and safety compliance. Strong knowledge of analog, digital, and mixed-signal PCB layout, including low-noise routing, grounding strategies, signal integrity, and EMI/EMC mitigation techniques. Experience in RF and high-speed PCB design, controlled impedance routing, differential pair routing, shielding, SI/PI considerations, and high-frequency layout practices. Knowledge of DFM, DFA, and DFT principles, PCB fabrication technologies, assembly processes, and design optimization for manufacturability and reliability. Understanding of advanced PCB technologies such as HDI, Flex PCB, RigidFlex PCB, and Metal Core PCB (MCPCB). Experience with simulation and analysis tools such as Ansys SIwave, HyperLynx, LTspice, CST Studio Suite, and Keysight ADS for signal integrity, power integrity, thermal, and RF analysis. Familiarity with automotive standards and requirements related to PCB design, including EMI/EMC, environmental robustness, reliability, and product qualification requirements. Experience supporting PCB-related failure analysis, design reviews, prototype builds, validation activities, and manufacturing issue resolution. 6 Likely Sources Bosch, Harman, Philips, Havells, Aptiv, Tata Electronics, Foxconn, Flex Ltd., Jabil, Sanmina, Dixon Technologies, VVDN, Kaynes Technology, SFO Technologies, Syrma SGS Technology, Avalon Technologies, Mefron Technologies, Centum Electronics etc