Principal SoC Chip Lead

Job description

Responsibilities: End-to-End Project Ownership : Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug. Technical Leadership : Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects. Cross-Functional Coordination : Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks. Program Execution & Risk Management : Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk. Stakeholder Management : Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews. Tape-Out & Silicon Readiness : Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution. Requirements: Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines. 6+ years of semiconductor industry experience. Proven experience in SoC development from architecture through tape-out. Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation. Experience leading large cross-functional engineering teams. Strong project execution, planning, and risk management skills. Excellent communication, leadership, and stakeholder management capabilities. Ability to influence technical direction and drive execution in a matrix organization. Preferred Qualifications: Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader Experience with automotive, industrial, or safety-critical semiconductor products. Experience working with global development teams across multiple sites. Successful delivery of multiple SoC tape-outs and post-silicon product ramps. Core Competencies Technical Leadership Cross-functional Collaboration Project Execution Excellence Risk Management Strategic Thinking Problem Solving & Decision Making Stakeholder Management Communication & Influence Customer Focus Results Orientation More information about NXP in Greater China... #LI-d6f4