Program Manager (Chip Development)

**About Ethernovia, Inc.** Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications. Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured **$154M** ($90+M Series-B and $64M Series-A) in **total funding** to date: - [Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips](https://www.businesswire.com/news/home/20260120549197/en/Ethernovia-Raises-Over-%2490-Million-Series-B-to-Scale-Leading-Edge-Autonomy-and-Physical-AI-Networking-Chips) - [Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire](https://www.businesswire.com/news/home/20230515005222/en/Ethernovia-Raises-64-Million-to-Accelerate-the-Revolution-of-Vehicle-Networks/) - (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital) Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025. - March 2026: [Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms](https://www.businesswire.com/news/home/20260316729719/en/Ethernovia-Announces-HSB-Enabled-Networking-Board-for-NVIDIA-Holoscan-Platforms) - January 2024: Our [CEO Ramin Shirani Named MotorTrend Software-Defined Vehicle Innovator Awards Winner ()](https://www.ethernovia.com/blog/ramin-named-motortrend-awards-winner/) - September 2023: [Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
 - Ethernovia](https://www.ethernovia.com/blog/continental-and-ethernovia-announce-partnership/) - **[Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news](https://www.autoconnectedcar.com/2023/09/connected-car-news-helios-continental-ethernovia-avanci-bmw-mapbox-porsche-sema-honda-ultrasense-flex-logix-diodes-inc-garmin-toyota-caruso/#Continental_Ethernovia_for_SDVs)** With talented employees on 4 continents, we have filed 50+ patents to date. Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility. **Program Manager (Chip Development)** **Summary:** - We're seeking an experienced and dynamic **Program Manager** to lead the end-to-end development lifecycle of complex integrated circuits (ICs). This role is all about defining, planning, executing, and finalizing chip development projects, making sure they're delivered on time, within budget, and to the highest quality standards, while strictly adhering to automotive industry requirements. You'll need a strong technical background in semiconductor design and manufacturing, coupled with exceptional leadership, communication, and problem-solving skills, particularly in the context of safety-critical and security-relevant systems, and a proven ability to manage customer relationships effectively. - This position is located in: **San Jose, CA** **Key Responsibilities** - **Program Leadership & Strategy:** - Define program scope, objectives, deliverables, and success criteria in collaboration with cross-functional teams (e.g., Architecture, Design, Verification, Physical Design, Software, Test, Product, Operations). - Develop and maintain comprehensive program plans, schedules, and budgets, including critical path identification and risk mitigation strategies. - Drive cross-functional alignment and accountability across all phases of the chip development lifecycle, from concept to silicon validation and mass production. - Act as the primary point of contact for the program, providing regular updates to stakeholders, senior management, and external partners. - **Automotive Standards Compliance & Management:** - **Ensure full compliance with ISO 26262 (Functional Safety)** throughout the chip development lifecycle, including defining Safety Goals, ASIL decomposition, managing safety requirements, and overseeing safety analyses (e.g., FMEDA, FTA). - **Oversee adherence to ISO/SAE 21434 (Automotive Cybersecurity)**, managing cybersecurity risk assessments (TARA), defining cybersecurity goals, and ensuring secure design & verification practices for the IC. - **Drive implementation and adherence to Automotive SPICE (ASPICE) process requirements**, ensuring robust software and hardware development processes, traceability, configuration management, and quality assurance. - Work closely with functional safety and cybersecurity managers to integrate these standards seamlessly into the overall program plan and execution. - Prepare for and support internal and external audits and assessments related to ISO 26262, ISO/SAE 21434, and ASPICE. - **Customer Relationship Management:** - **Serve as the primary technical and program interface to key customers**, understanding their needs, expectations, and ensuring their satisfaction throughout the development lifecycle. - Effectively communicate program status, technical progress, and any potential issues or changes to customers. - Proactively manage customer expectations and negotiate technical and schedule tradeoffs to achieve mutual success. - Translate customer requirements into actionable internal development plans and ensure effective feedback loops. - **Execution & Monitoring:** - Lead and motivate diverse technical teams, fostering a collaborative and high-performance environment. - Track program progress against milestones, identify deviations, and implement corrective actions. - Proactively identify and manage program risks, dependencies, and issues, escalating as necessary. - Facilitate effective communication and decision-making across all levels of the organization. - Manage change requests and ensure proper impact analysis and approval processes are followed. - **Technical Acumen:** - Possess a strong understanding of the complete chip development flow, including RTL design, synthesis, place and route, timing closure, verification methodologies, DFT, analog/mixed-signal integration, packaging, and silicon bring-up. - Collaborate with technical leads to resolve complex engineering challenges. - Ensure adherence to design methodologies, quality standards, and industry best practices. - **Stakeholder Management:** - Build and maintain strong relationships with internal teams, external vendors (e.g., foundries, IP providers), and customers. - Manage expectations and negotiate tradeoffs to achieve program goals. - Prepare and deliver compelling presentations to various audiences, including executive reviews and technical forums. - **Continuous Improvement:** - Conduct post-mortems and lessons learned sessions to identify areas for process improvement. - Implement best practices in program management and contribute to the evolution of our development methodologies. **Qualifications** - **Education:** Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field. - **Experience:** - 8+ years of experience in the semiconductor industry, with at least **3-5 years in a dedicated program or project management role** for chip development projects. - Proven track record of successfully leading multiple complex **ASIC/SoC development programs** from concept to high-volume production. - **Demonstrable experience and strong understanding of ISO 26262, ISO/SAE 21434, and Automotive SPICE (ASPICE) requirements and implementation in semiconductor development.** - Experience with **Automotive Safety Integrity Levels (ASILs)** and **Threat Analysis and Risk Assessment (TARA)** processes. - Strong understanding of semiconductor fabrication processes (e.g., FinFET, FD-SOI) and packaging technologies. - Experience with various silicon technologies (e.g., CPUs, GPUs, DSPs, AI accelerators, custom ASICs) for automotive applications is a plus. - **Technical Skills:** - Familiarity with industry-standard **EDA tools** and design flows (e.g., Cadence, Synopsys, Siemens EDA). - Knowledge of various verification methodologies (e.g., UVM, formal verification). - Understanding of power management, clocking architectures, and high-speed interfaces. - **Program Management Tools & Skills:** - **Proficiency and hands-on expertise with Atlassian tools, specifically Jira for issue tracking, project management, and reporting, and Confluence for documentation, knowledge sharing, and collaboration.** - Strong understanding of program management methodologies (e.g., Agile, Waterfall, Hybrid). **PMP or equivalent certification is highly desirable.** - Excellent analytical, problem-solving, and decision-making abilities. **Desired Attributes** - **Exceptional Communication:** Outstanding verbal and written communication skills, with the ability to articulate complex technical information clearly and concisely to diverse audiences, including customers, regulatory bodies, and auditors. - **Strong Leadership:** Ability to inspire, motivate, and guide cross-functional teams without direct authority. - **Results-Oriented:** A drive to achieve aggressive goals and a commitment to delivering high-quality, safety-compliant, and secure products. - **Proactive & Resourceful:** Ability to anticipate challenges, identify solutions, and adapt to changing priorities in a fast-paced and regulated environment. - **Collaborative:** A team player who thrives in a collaborative environment and builds strong working relationships internally and externally. - **Customer-Centric:** A strong focus on understanding and meeting customer needs, with a track record of building and maintaining positive customer relationships. - **Attention to Detail:** Meticulous approach to planning, execution, and monitoring of program activities, with a strong emphasis on documentation for compliance. - **Business Acumen:** Understanding of the automotive market, customer needs, and the financial implications of program decisions. **What You Can Expect from Ethernovia:** - Technology depth and breadth expansion that can’t be found in a large company - Opportunity to grow your career as the company grows - Pre IPO stock options - Cutting edge technology - World class team - Competitive base salary - Flexible hours - Medical, dental and vision insurance for employees **Salary Range:** - The actual offered base salary will vary depending on factors such as individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $150,000 - $230,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits.