Semiconductor Package Competitive Analysis Intern

Job description

Competitive Analysis Intern – Package Innovation Role Summary Support the Package Innovation (PI) team in building competitive intelligence through structured analysis of semiconductor packaging technologies, market trends, and competitor activities. Key Responsibilities Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements Develop insights on packaging trends, cost/performance positioning, and technology differentiation Conduct startup and emerging technology evaluations relevant to advanced packaging Consolidate findings into clear, executive-ready reports and dashboards for PI leadership Maintain and enhance competitive analysis databases and tracking frameworks Additional Exposure Participate in ATKL manufacturing projects to gain foundational understanding of semiconductor assembly processes Qualifications Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field Strong analytical mindset with ability to synthesize large datasets into actionable insights Proficient in Excel and PowerPoint; data analysis or visualization experience preferred Familiarity with AI tools and advanced search techniques for efficient data mining is highly desired Strong communication skills with ability to clearly present findings More information about NXP in Malaysia... #LI-633a