Senior Manufacturing Engineer – Thin Film Engineering (PVD, PECVD, ALD & RIE)

Job description

About Ensurge Micropower Ensurge Micropower (OSE: ENSU) is a pioneer in solid-state microbattery technology, enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for wearables, health tech, industrial sensing, and defense applications. As our technology transitions from development to production, disciplined manufacturing execution becomes the differentiator. Role Overview Ensurge is seeking a Senior Manufacturing Engineer (IC) to own and scale the Thin-Film Engineering processes — deposition (PVD/Sputtering, PECVD, ALD) and etch (RIE) — from pilot through early production. This role is not just about process — it is about delivering manufacturing results. Responsibilities Own daily manufacturing performance for the PVD/Sputtering, PECVD, ALD, and RIE process areas Drive output, yield, uptime, and cycle time Support production directly — troubleshooting issues in real time Partner with Operations to ensure line execution meets plan Convert R&D processes into repeatable, production-ready workflows Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias, and endpoint detection (RIE) Define and lock control limits and OCAPs Ensure processes are robust, stable, and scalable Work with Equipment Engineering to: Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems, RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems) Improve reliability and uptime Implement process-driven upgrades Lead tool qualification and process acceptance Ensure equipment supports throughput, precision, and repeatability Own flow from substrate input → deposition/etch → downstream handoff to assembly Reduce bottlenecks, WIP, and inefficiencies Improve line balance and production scheduling alignment Support layout and flow improvements as the system scales Partner with Quality to implement: SPC and process control on film thickness, stress, uniformity, and conformality Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPs Traceability and data capture Build and maintain: SOPs Process specs Control plans Ensure manufacturing is data-driven and auditable Lead structured RCA on: Yield loss Defects Downtime Use characterization data (SEM, XRD, cross-section imaging) to root-cause excursions Implement sustainable fixes — not workarounds Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.) Qualifications Required 7–12+ years in manufacturing engineering with thin-film deposition and etch (PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film industries Proven experience owning manufacturing processes on the floor Strong track record of driving yield and throughput improvements Experience supporting or leading pilot → production scale-up Hands-on mindset — comfortable working directly with equipment, technicians, and operators Working knowledge of thin-film characterization techniques (e.g., ellipsometry, profilometry, XRD, SEM) and their use in validating and controlling deposition processes Preferred Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection (RIE/ICP-RIE) Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing Vacuum systems and chamber conditioning experience Experience with image-based film/defect characterization (SEM, optical microscopy) and correlating characterization data back to process control limits Experience with MES, traceability systems, or data-driven manufacturing Salary Range: $162,000-$198,000 The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.