Senior Package Substrate Design Engineer

About the role We are seeking an experienced Package Substrate Design Engineer to join us and own package and substrate design for the chips and multi-die modules at the heart of Lyte’s fully vertically integrated 4D FMCW LiDAR platform - from early package feasibility and bump/ball planning, through substrate layout and design rule verification, to drawing release and volume production. You will work hands-on with Lyte’s US teams and with our OSAT and substrate supplier partners in Taiwan to deliver manufacturable flip-chip, wire-bond, SiP, and advanced (fan-out / chip-on-wafer) package solutions, along with the test interface hardware that supports them. What you'll do Own package and substrate physical design for Lyte’s chips and multi-die modules, driving layouts from early planning through implementation, verification, and manufacturing release. Perform package surveys and feasibility studies — body size, bump pad and ball arrangement, die placement, wire length/count estimation, layer count and stack-up options, and routing feasibility — and present cost, performance, and schedule trade-offs. Design package substrates in Cadence Allegro Package Designer (APD) / SiP Layout, including bump maps, escape routing, power/ground distribution, plane design, and controlled-impedance routing for high-speed and sensitive analog/mixed-signal nets. Execute designs across package technologies: flip-chip CSP/BGA (Cu pillar, bump-on-trace), wire-bond FBGA/LGA, stacked-die and side-by-side MCP/SiP, coreless and ETS substrates, and embedded passive (MLCC/IPD) solutions. Extend Lyte’s package design capability to advanced packaging — fan-out RDL (InFO-type), chip-on-wafer and 2.5D/3D integration — including co-packaging of CMOS and silicon photonics die and accommodating optical I/O (fiber attach, optical windows, keep-out zones). Set up design rule constraints from OSAT, foundry, and substrate supplier rule decks; run and resolve DRC/LVS and connectivity checks, working with tool vendors (e.g., Cadence) on complex rule violations. Partner with HQ chip designers on die pad/bump planning and package–die co-design, and with SI/PI, thermal, and mechanical engineers to incorporate simulation results (impedance, crosstalk, IR drop, PDN, warpage, thermal) into the layout. Create and maintain release documentation: substrate unit and strip drawings, bonding diagrams (BD), package outline drawings (POD), stencil and packing tray drawings, Gerber/ODB++ outputs, and design release packages under ECN/change control. Design test interface hardware with Lyte’s test engineers and partner vendors — probe card substrates (multi-DUT MLO/MLC), wafer-level and final-test load boards, and open/short (OS) boards — optimizing layer count, via structures, and DUT layout. Design PCBs for package qualification and failure analysis (e.g., temperature cycling and board-level drop test boards) and support package reliability qualification. Work directly with OSAT and substrate supplier partners on substrate specifications, DFM/DFA reviews, engineering lots, yield issues, and engineering change orders (ECOs). Act as technical project manager for package design workstreams and report status, risks, and production readiness to Lyte’s US-based engineering and Technical Operations leadership. Regularly visit OSATs, substrate suppliers, and test partners in Taiwan and Asia to support NPI and volume production, and provide written reports. Required Qualifications Bachelor’s degree in Electrical Engineering, Electronic Engineering, Materials Science, Mechanical Engineering, or a related field; advanced degree a plus. 8+ years of hands-on IC package and substrate design experience at an OSAT, foundry, fabless/IDM company, or test interface supplier. Expert proficiency in Cadence Allegro Package Designer (APD) and/or SiP Layout; working proficiency in Allegro PCB Editor/OrCAD, AutoCAD, and CAM tools (e.g., CAM350). Proven design experience on flip-chip (fcCSP/fcBGA) and wire-bond (FBGA/LGA) packages, including bump/ball map planning, stack-up definition, and substrate routing. Solid understanding of organic substrate technologies and manufacturing processes (build-up, coreless, ETS, HDI, stacked and through vias) and package assembly processes (flip-chip attach, wire bonding, die attach, molding). Experience setting up design rules and resolving DRC/LVS violations against OSAT, foundry, and substrate supplier rule sets. Working knowledge of package-level signal integrity and power integrity fundamentals, including impedance control and power/ground distribution. Experience producing package release documentation (substrate drawings, bonding diagrams, POD) and manufacturing outputs. Experience working directly with OSATs and substrate suppliers on DFM/DFA, engineering builds, and design changes. Project management capability/experience is a must, with the ability to manage multiple design projects in parallel and meet schedules. Ability to travel within Taiwan and across Asia (up to ~25%) to OSAT, supplier, and partner sites. Excellent written and verbal communication skills in English and Mandarin; able to work directly with Lyte’s HQ teams across time zones and with local partners. Ability to work independently and take ownership of projects as well as collaborate effectively in a fast-paced, cross-functional startup environment is a must. Fast learner with good work ethics is a must. Capable of keeping company confidential information and IP is a must. Preferred Qualifications Experience with advanced packaging design: fan-out RDL (InFO-type), CoWoS / chip-on-wafer, 2.5D interposers, or 3D-IC, including advanced foundry packaging design rules. Experience with package-on-package (PoP/HBPoP) structures, mold through-via / laser via, and embedded passive (MLCC/IPD) substrates. Experience designing test interface hardware: vertical probe card substrates (MLO/MLC, multi-DUT), load boards, and open/short boards. Hands-on SI/PI, thermal, or warpage simulation (e.g., Ansys SIwave/HFSS, Cadence Sigrity/Clarity, Keysight ADS) is a plus. Scripting or design automation skills (e.g., Cadence SKILL, Python) for layout automation and design checks. Prior experience at, or working closely with, a Taiwan OSAT, foundry packaging group, or substrate supplier (e.g., ASE/SPIL, Amkor, TSMC advanced packaging, Unimicron, Kinsus, Nan Ya PCB) is highly desired. Experience leading design projects or coordinating offshore layout resources is a plus. Familiarity with optoelectronic or silicon photonics packaging (fiber attach, optical alignment, laser/photodetector integration). Experience with automotive or other high-reliability standards (AEC-Q100/Q104, IATF 16949, JEDEC reliability qualification) is a plus. Understanding of silicon photonics, FMCW LiDAR, or related sensing technologies is a plus. Benefits (subject to location and local regulations) Competitive salary and equity Flexible vacation and time-off policy Collaborative, fast-paced, and inclusive work environment Opportunity to work on cutting-edge technologies with a highly cross-functional team About Lyte Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!