Senior Quantum 3D Integration and Packaging Engineer

Job description

Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We Offer Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits . As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. At Applied’s CTO group, we focus on solid-state solutions for quantum technology, i.e. superconducting qubits and optical quantum computing. Our primary objective is to collaborate with system companies and universities to develop quantum devices with significantly lower error rates compared to current standards. Our approach centers on harnessing state of the art materials engineering and semiconductor processing, as well as our expertise in advanced (metasurface-based) optics to enhance device performance. To achieve this goal, we're seeking a passionate technologist with strong semiconductor and 3D integration background to develop advanced packaging solutions for emerging markets and new technology inflection on quantum information. We value our people and teams who turn possibilities into reality. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow. Responsibilities Create 3D integration and packaging solutions for different platforms and quantum structures Work with advanced packaging, process, hardware, and metrology team to develop new materials, processes, and structures for quantum devices Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues Generate internal and external documentation for products, presentations and technical reports Design and conduct experiment, measure material and device properties and interpret data Keep up to date with the latest advancements in 3D integration, quantum information, and related fields to continually implement new technologies, enhance approaches, and develop methodologies Collaborate with customers, start-ups, or universities to identify key problems and develop enabling solutions Requirements PhD, Master's, or Bachelor's degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field. 5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development. Strong knowledge of wafer-level packaging, hybrid bonding, TSV, chiplets, flip-chip, and related packaging technologies. Hands-on experience in semiconductor fabrication, process integration, materials characterization, and metrology. Experience with DOE, data analysis, process optimization, and root cause analysis. Familiarity with quantum devices, superconducting technologies, photonics, or cryogenic systems is a strong plus. Strong problem-solving, technical communication, and cross-functional collaboration skills. Ability to work effectively with customers, startups, universities, and multidisciplinary R&D teams. Work Location Science Park II (Moving to Tampines office starting May 2027) Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.