Senior Staff Process Engineer (LLO, Wafer Bonding & Grinding, Laser Dicing)

The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics. At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day. Show the world what you are made of. Your new responsibilities Lead process development and optimization for laser dicing & singulation/ wafer back grinding / laser lift off (LLO)/ wafer bonding. Define and optimize process parameter to meet quality, yield, and throughput target. Ensured process robustness through implementation of LOD, SPC, and advanced control strategies. Improved process stability and reduced variation through data-driven analysis and continuous monitoring Perform risk assessments using FMEA (Failure Mode and Effects Analysis) to identify potential failure modes, evaluate risks, and implement appropriate control measures to mitigate them. Establish, review, and maintain process controls and mitigation plans to ensure product quality, process stability, and compliance with operational standards. Ensure all processes and documentation meet quality standards, regulatory requirements, and customer specifications, supporting audit readiness and continuous compliance. Engage closely with Equipment Engineers to gain a deep understanding of process and equipment capabilities, and evaluate their impact on overall manufacturing processes and performance. Collaborate with Product Integration, FPD, and NPI teams to understand product requirements, integration flows, and process interactions, ensuring alignment between equipment capability and product specifications. Drive continuous improvement initiatives, focusing on tool design enhancements and implementation of Poka-Yoke (error-proofing) solutions to improve yield, reliability, operational efficiency and tool up time efficiency for laser dicing/ wafer grinding / Laser lif Off/ wafer bonding. Collaborate closely with RBG (Regional/Remote Business Group) counterparts to ensure synchronization of process changes and seamless implementation across both sites. Develop and drive future equipment strategy (CEPT/BEST) for critical processes, including wafer bonding, laser lift-off, laser dicing & singulation, and wafer back grinding. Lead end-to-end activities for equipment lifecycle management, including procurement specification, evaluation, and purchase of new tools. Plan and execute engineering and operational activities within the area of responsibility to ensure stable production and support manufacturing targets. Work cross-functionally with manufacturing, engineering, and suppliers to ensure equipment readiness, process capability, and alignment with long-term technology roadmaps. Lead engineering efforts to support root cause identification of non-conformances, utilizing structured problem-solving methodologies; take ownership in implementing corrective and preventive actions (CAPA) to prevent recurrence. Establish and implement control measures to ensure compliance with ISO/TS 16949, ISO 45001, ISO 14001, and other applicable standards, while actively leading and supporting customer and certification audits. What we look for Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering Min. 10 years experience in manufacturing environment Min. 5 years experience in dicing/ grinding / LLO/ Bonding process engineering Fluency in English and Bahasa Malaysia. Please contact Shin Yih Cheah for further information via .