SMT Technology Expert (Soldering & PCB assembly)

Job description

Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference. Job Description: Summary: We are seeking an experienced SMT (Surface Mount Technology) Technology Expert to serve as the primary technical authority for resolving complex chip soldering defects encountered at customer sites. You will be responsible for root-cause analysis of field failures, optimizing reflow profiles, selecting advanced solder materials, and providing critical Design-for-Manufacturing (DFM) feedback to our internal R&D teams to ensure first-pass yield and long-term reliability. RESPONSIBILITIES: Customer Site Support & Failure Analysis Act as the technical leader for SMT-related issues reported by customers (e.g., tombstoning, voiding, head-in-pillow, cold joints, opens, and excessive warpage). Process & Materials Optimization Evaluate and select appropriate solder paste (Type 4/5/6 powders, alloys, fluxes) based on pad design and component pitch. Develop, optimize, and validate reflow oven profiles (soak zone, peak temperature, TAL) specifically tailored for our chip packages (QFN, BGA, LGA, etc.) to minimize thermal stress and warpage. Define stencil design specifications (aperture, thickness, step-down/stencil nano-coating) to improve solder paste release and reduce voiding. Design Guidance & DFM/DFA Review and approve PCB landing pad designs (SMD/NSMD pads) to ensure compatibility with high-volume SMT assembly. Collaborate with Package/R&D engineers to provide Package-to-Board interaction guidelines. Advice on substrate design, surface finish (NiAu, ENIG, ENEPIG, OSP, Immersion Ag), and solder mask definitions to prevent solderability issues. Advanced Technical Consulting (Preferred) Influence IC Package Design at the early stage by providing insights into how package construction (die attach, warpage control, ball layout) affects SMT yields. Establish internal standards for SMT assembly of new products (NPI - New Product Introduction). Perform other tasks assigned by superiors. REQUIREMENTS: Education: Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electronics Engineering, or related fields. Experience: 8+ years of hands-on experience in SMT process engineering, preferably within the semiconductor, OSAT, or EMS industries. Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.