Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)

SR. PACKAGING ENGINEER – THERMAL MATERIALS, AI SATELLITES (STARMIND)

SpaceX is leveraging its experience deploying and operating the world’s largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. Realizing this vision demands highly reliable, high performance electrical compute hardware, solar power systems, thermal radiators, and more. These systems must operate in the extreme environment of space while delivering the connectivity, control, power distribution, and processing needed for orbital AI inference.

The Starmind team designs, builds, and operates the orbital compute fabric of the future. We develop nearly every key piece of technology in house – from the satellites’ flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers. As a Sr. Packaging Engineer on the Starmind team, you’ll have ownership over the entire life-cycle of the hardware that enables advanced on-orbit AI processing and data center workloads. Your work sits at the intersection of process, packaging, materials, and thermal engineering. The Payload team is responsible for the design of industry-leading compute electronics, memory, and networking in order to achieve required domain sizes and processing workloads.

RESPONSIBILITIES:

• Own the full lifecycle of advanced packaging through board assembly process development— including requirements capture, materials selection, prototyping, process optimization, manufacturing, and failure analysis.
• Drive system trades, requirements capture, materials selection, prototyping, manufacturing, failure analysis.
• Spearhead the development integrated thermal solutions including next generation TIMs to improve package performance.
• Own the full lifecycle of equipment specification, qualification, and ramp.
• Build supply chains for die, packages, components, consumable chemicals, and equipment for satellite compute manufacturing. Define incoming acceptance criteria for components and materials.
• Work closely with engineers from adjacent disciplines (mechanical, thermal, materials, electrical, software, test engineering, supply chain, silicon design, etc.) to deliver tightly integrated, high-performance hardware
• Challenge assumptions, question requirements, learn from your mistakes, and approach problems with an open mind
• Collaborate closely with leadership and stakeholders across all departments—including design, reliability, production, and supply chain to deliver best in class electronics.
• Manage compliance risks, ensuring safety and environmental compliance with industry standards.
• Mentor and develop engineers, providing technical guidance and project oversight.

BASIC QUALIFICATIONS:

• Bachelor's degree in materials science, mechanical engineering, or similar discipline.
• 5+ years experience in microelectronics device research or manufacturing.

PREFERRED SKILLS AND EXPERIENCE:

• Experience in hardware, robotics, automation, or manufacturing environments
• Experience designing tooling, fixtures, or jigs for assembly or test applications
• Exposure to scripting or data analysis tools (e.g. MATLAB, JMP, or equivalent) for process data analysis or automation
• Experience working with precision assemblies, robotic systems, or automated pick-and-place equipment
• Familiarity with manufacturing process development methodologies (e.g., PFMEA, process capability studies, SPC)
• Exposure to GD&T and tolerance analysis as applied to fixture and tooling design
• Experience with or interest in production data systems, MES, or manufacturing traceability infrastructure
• Familiarity with cleanroom or controlled-environment manufacturing practices

ADDITIONAL REQUIREMENTS:

• Ability to work extended hours or weekends as needed for mission critical deadlines
• Some travel may occasionally be required