Sr Principal Semiconductor Equipment Engineer

RELOCATION ASSISTANCE: No relocation assistance available CLEARANCE REQUIRED FOR START: No CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies. Northrop Grumman Mission Systems is looking for you to join our team as a Sr. Principal Semiconductor Equipment Engineer for our Advanced Packaging Technology Fab based in Apopka, Florida . Northrop Grumman’s semiconductor foundry and packaging lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. The wafer bumping line will support flip chips, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chips, 2.5D, and 3D packaging. The Semiconductor Equipment Engineer will lead and manage engineering projects such as equipment layout, cleanroom construction and installation of semiconductor equipment along with the daily, weekly, bi-weekly, quarterly, semiyearly and year equipment maintenance. Responsibilities include all aspects of facilities and factory layout for foundry equipment. The chosen candidate will develop and apply continuous improvement programs and be responsible for all aspects of project management including working with and direction of contractors/sub-contractors along with alignment with management. May be responsible for running a group or groups of tools, from day-to-day maintenance/preventative maintenance operations (i.e. chemical management) up to and including service contracts with vendors. Minimal travel - one to three short trips per year. The ideal candidate will: Have a demonstrated ability to work with cross organizational teams such as engineering, line maintenance and building maintenance. Possess strong leadership and communication skills. Be flexible to potentially work second shift as needed. Be willing and able to be on call. Basic Qualifications for the Semiconductor Equipment Engineer: A bachelor’s degree in related STEM field with a minimum of 8 years of relevant work experience; OR a master’s in a related STEM field with 6 or more years of relevant work experience; OR 12 years of relevant work experience in lieu of a degree. A minimum of 6 years of experience working with semiconductor fabrication equipment or the construction industry. Experience with semiconductor wafer fabrication facilities and operation. Experience with fab facility, equipment installation, and maintenance. Experience with Computerized Maintenance Management System. Ability to obtain and maintain a Secret clearance. US Citizenship required. Preferred Qualifications: Experience with semiconductor equipment. Experience with semiconductor clean room design and construction. Experience with Architecture and Engineering (“A&E”) drawing sets. Experience with AutoCAD design. Experience managing strategic projects from inception through completion; including financial, risk and schedule management. Experience in low volume/high product mix environments. Experience interfacing with vendors for equipment repairs, service contracts, and purchase preferred. Active Secret clearance. What We Can Offer You: Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more! #MPR Primary Level Salary Range: $122,800.00 - $184,200.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit . U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.