Sr. Principle Systems / Rack Thermal Engineer

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at [](http://www.asteralabs.com/). # Senior Principal Thermal Engineer **Location:** Research Triangle Park (RTP), North Carolina **Department:** Hardware Engineering / System Architecture **Employment Type:** Full-Time We are seeking a **Senior Principal Thermal Engineer** to lead thermal architecture across next-generation AI systems, networking platforms, optical interconnects, and rack-scale infrastructure. # The Opportunity This is a highly visible technical leadership role responsible for defining thermal strategy across: - PCIe Scale-Up Fabrics - UALink Scale-Up Networks - Ethernet Scale-Out Fabrics - ESUN Network Architectures - Advanced Fiber Connectivity Solutions - GPU Compute Platforms - Rack-Scale AI Systems - Near Package Optics (NPO) - Co-Packaged Optics (CPO) - Air-Cooled and Liquid-Cooled Open Rack Platforms You will work closely with System Architects, Mechanical Architects, Power Architects, Silicon Engineering Teams, Software Architects, and ODM partners such as Accton, Hyve, Quanta, Wistron, and Gigabyte. # What You'll Do ## Define End-to-End Thermal Architecture - Develop thermal architecture from silicon devices through complete rack-scale AI systems. - Define thermal budgets, cooling requirements, and performance objectives. - Drive architecture decisions balancing performance, reliability, power, density, and cost. - Establish multi-generation thermal roadmaps supporting future AI infrastructure. ## Lead AI Rack and Platform Cooling Design Provide thermal leadership for: - GPU Compute Platforms - PCIe Scale-Up Switch Platforms - UALink Switch Systems - Ethernet Scale-Out Platforms - Rack Controllers - AI Accelerators - Optical Interconnect Systems Develop system-level cooling strategies supporting next-generation high-density AI deployments. ## Develop Advanced Air and Liquid Cooling Solutions - Architect airflow solutions for high-performance computing systems. - Define direct liquid cooling and cold plate solutions. - Support advanced rack cooling technologies. - Develop thermal strategies for future 100kW+ AI racks. - Optimize thermal performance while reducing infrastructure cooling cost. ## Lead Optical Thermal Innovation Develop thermal solutions for: - Near Package Optics (NPO) - Co-Packaged Optics (CPO) - Optical Engines - Silicon Photonics Platforms - Fiber Connectivity Infrastructure - Optical Transceivers and Modules Address thermal interactions between: - Optical engines - High-speed SerDes - Switch ASICs - GPU interconnects - Rack cooling systems ## Drive Thermal Modeling and Validation - Lead CFD simulation activities. - Perform system-level airflow analysis. - Develop thermal design guidelines. - Correlate thermal simulations with lab measurements. - Establish validation procedures and thermal KPIs. ## Collaborate with ODM Partners Work directly with ODM and JDM partners to: - Define thermal requirements - Review rack and platform thermal designs - Resolve thermal bottlenecks - Support qualification and manufacturing readiness - Ensure compliance with Open Rack design objectives ## Partner Across Engineering Functions Collaborate closely with: - System Architecture - Mechanical Engineering - Power Architecture - Electrical Engineering - Silicon Design - Reliability Engineering - Manufacturing Operations to deliver industry-leading AI infrastructure solutions. # Required Qualifications - BS, MS, or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Physics, or a related discipline. - 15+ years of thermal engineering experience. - Proven track record leading thermal architecture for AI infrastructure, networking platforms, servers, storage, or hyperscale systems. - Deep expertise in: - Heat Transfer - Conduction and Convection - Airflow Optimization - Thermal Characterization - Cooling System Design - Rack-Level Thermal Architecture - Hands-on experience using: - ANSYS Icepak - FloTHERM - 6SigmaET - CFD tools and methodologies - Strong experience with thermal validation and correlation techniques. # Preferred Qualifications - Experience supporting NVIDIA, AMD, or Intel-based AI platforms. - Experience with Open Rack and OCP architectures. - Expertise in liquid cooling technologies. - Familiarity with PCIe Scale-Up and UALink systems. - Experience with Ethernet scale-out networking. - Experience supporting optical technologies including: - NPO - CPO - Optical Engines - Silicon Photonics - Fiber Connectivity Systems - Experience supporting rack power densities exceeding 50kW and scaling toward future 100kW–250kW deployments. - Experience working directly with ODMs and hyperscale customers. # Leadership Attributes The ideal candidate will demonstrate: - Strong systems thinking - Strategic technology leadership - Cross-functional influence - Excellent communication skills - Ability to drive architecture across multiple organizations - Passion for solving complex infrastructure challenges # Why Join Us? You will help define the thermal architecture for technologies that power the world's most advanced AI systems, including: - PCIe Scale-Up Infrastructure - UALink Fabrics - Ethernet Scale-Out Networks - Advanced Fiber Connectivity - NPO and CPO Optical Architectures - Open Rack AI Platforms - Future AI Factory Deployments This role offers a unique opportunity to influence industry-leading products and shape the future of rack-scale AI infrastructure. ## Apply Today If you are passionate about thermal innovation, AI infrastructure, optical systems, and rack-scale architecture, we'd love to hear from you. The salary range is $195,000 to $250,000, depending on experience, level, and business needs. This role may be eligible for discretionary bonuses, incentives, and benefits. **Join us in Research Triangle Park and help engineer the cooling technologies that power the future of AI.** We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.