Substrate/Package Layout Engineer

Job description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role, you will have primary responsibility for the layout, routing, and functionality of packages and substrates, including design of high-speed lines. Expertise with design tools, such as Calibre/Klayout and Cadence tools (e.g. Allegro Package Design, Innovus, and Virtuoso) is required. In this role you will work closely with other core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers. Peer reviews of substrate/package designs is also an important element of the role. You will work with substrate/package vendors to define layout/panel/stack-up design and other specifications. In addition to the front end layout work, you will also help evaluate the parts when they come back from the fab. This includes visual inspection, electrical functionality, and characterization of the high speed electrical lines. Responsibilities: Design and layout advanced substrates and IC packages Develop and utilize a script-based layout tools. Collaborate with design and verification teams to ensure layout meets specifications and performance requirements. Perform design rule checking (DRC) and layout vs schematic (LVS) check. Contribute to the development and improvement of layout methodologies and flows Job requirements: Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience. Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools. Broad understanding of multilayer high speed rf-design, package/substrate manufacturing processes and materials, and surface mount technology, Simulations of designs and improvement suggestions. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $ 226,000 . As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.