Telematics & Connectivity Hardware (India)

Job description

Division R&D Department EV Electronics Level Ex Functional Area Telematics, Cluster, ARAS 1 Job Title Manager (R&D) 2 Reporting Leadership, R&D – EV Electronics 3 Educational Qualification Essential: B.E/ B Tech in Electrical, Electronics/Instrumentation M Tech in Electronics is preferred; Min. 70% required at all levels of education Experience Minimum: 3 Maximum: 12 Age Limit Minimum: 26 Maximum: 34 4 Job Role & Responsibilities Role: Connectivity solutions hardware Design and develop automotive-grade electronic hardware for Electric Vehicle (EV) systems including Telematics Control Units (TCU) , Instrument Clusters, Access Control Modules , Infotainment Systems, and connected vehicle platforms. Define hardware architectures and perform circuit design for mixed-signal, high-speed digital, RF, power management , sensor interface, and communication subsystems. Design and optimize RF hardware including antenna interfaces, matching networks, RF front-end circuits, filters, LNAs , protection circuits, and wireless connectivity modules supporting 4G/5G/LTE, NB-IoT, GNSS, BLE, and Wi-Fi technologies. Develop robust power architectures incorporating DC-DC converters, LDOs, battery protection, and automotive transient/surge immunity circuits compliant with automotive standards. Design hardware interfaces for secure elements , SIM/eSIM, memory devices, displays, touch interfaces, backlight systems, and vehicle sensors such as IMUs, radar, ultrasonic, and environmental sensors. Implement and validate digital communication interfaces including CAN/CAN-FD, Automotive Ethernet, UART, SPI, I²C, USB, LIN , and high-speed serial interfaces. Perform detailed schematic design, component selection, tolerance analysis, derating analysis, worst-case circuit analysis, and reliability assessments. Develop complete hardware design documentation including system architecture, block diagrams, schematics, BOMs, design calculations, validation plans , and manufacturing documentation. Lead PCB design activities including stack-up definition, component placement, signal integrity considerations, power integrity optimization, grounding strategy, and routing reviews. Design for EMI/EMC compliance through appropriate filtering, shielding, grounding, isolation, and layout techniques to meet automotive regulatory and OEM requirements. Conduct circuit simulations and analyses including SPICE simulations, power integrity analysis, signal integrity evaluation, thermal assessment, and Monte Carlo simulations. Execute hardware bring-up , board validation , debugging , root-cause analysis , and failure investigations using laboratory instruments such as oscilloscopes, spectrum analyzers, network analyzers, logic analyzers, and power analyzers. Support environmental, reliability, EMC/EMI, and regulatory qualification testing and drive corrective actions for identified issues. Collaborate closely with firmware, software, mechanical, and system engineering teams to ensure seamless hardware-software integration and overall system performance. Interface with semiconductor vendors, PCB manufacturers, EMS partners, and component suppliers to support prototype development, DFM/DFT reviews, production readiness, and cost optimization. Drive hardware design improvements focused on reliability , manufacturability, testability, cost reduction, component lifecycle management, and production yield enhancement. Evaluate hardware consolidation opportunities and next-generation ECU architectures to optimize system cost, packaging efficiency, power consumption, and functional integration. 5 Competency Requirements Behavioural: Promotes and champions change Strong team player with the ability to lead/mentor group of engineers. Demonstrates proactive thinking , anticipating issues and taking timely action. Maintains high standards of technical documentation , including design calculations and engineering reports. Encourage technology and cost innovation within the team along with IP generation Ability to translate concepts into practical real-world solutions . Effective communication with team, peers, suppliers and leadership (written and oral communications) Collaborates with cross-functional teams to develop innovative solutions. Specific expertise required for functional areas: Knowledge of electric vehicle standards and regulations, including ISO 26262 (Functional Safety) , CISPR/ISO (EMC) , ISO 7637, and AIS standards. Familiarity with the automotive product development lifecycle Strong understanding of DFSS (Design for Six Sigma) methodology. Strong fundamentals in analog, digital, and mixed-signal electronics . Proficiency in schematic design, circuit analysis , and simulations. Hands-on experience with PCB layout reviews , SI/PI considerations for automotive hardware. Experience in designing hardware for automotive-grade performance, reliability, optimization, and cost efficiency . Hands-on experience with LTE/4G/5G/NB-IoT modems, GNSS receivers, BLE, and Wi-Fi SoCs . Strong understanding of RF fundamentals including antenna design, impedance matching, return loss, VSWR, filter design, and sensitivity optimization . Ability to perform RF validation and troubleshoot wireless performance issues. Familiarity with vehicle communication protocols : CAN, LIN, UART, SPI, I2C , and related debugging/analysis tools. Experience building low-noise analog front ends , sensor interfaces, and signal-conditioning circuits. Proficient in using laboratory test equipment: Oscilloscope, DMM, LCR meter, Network Analyzer, Spectrum Analyzer, Power Analyzer , and related diagnostic tools. 6 Likely Sources Bosch, Philips, Continental, Vitesco, Valeo, Aptiv, Harman, KPIT, Denso, ZF, Hella, Honeywell, Ather, OLA, Honda, Ultraviolette, Raptee, Ford, EVA, Hero, Tata motors, Hyundai Mobis, etc